Our package options streamline components for reduced footprint size
Fully Integrated Module
Option for fully integrated passive module
Silicon substrate provides option for integrated capacitors and inductors due to the high frequency operation of Endura’s patented eVR
Integrated module provides the smallest integrated solution on the market
Under Package
(Land Side)
Substrate integrated inductors for an ultra-thin solution that can be mounted on the land side of the organic package substrate
Capacitors mounted around the periphery for peak performance
eVR substantially improves system efficiency
Back Side of Motherboard
Fully integrated module with integrated capacitors and inductors for smallest footprint
Mounts on back side of motherboard for additional option to provide all the benefits of eVR
Allows for additional thermal management solutions
